AMD to Introduce New Enthusiast-Class Graphics Cards This Quarter
As part of their quarterly earnings call this week, AMD revealed that the company is getting ready to launch new enthusiast-class Radeon RX 7000-series graphics cards in the coming...
30 by on 8/3/2023
Intel Plans Massive Expansion in Oregon: D1X and D1A to Be Upgraded
Intel has filed a permit application that outlines significant expansion plans for its campus near Hillsboro, Oregon. According to filings submitted to state regulators, the tech giant's ambitious proposals...
4 by on 8/2/2023
Intel Quietly Launches New Arc GPUs for Laptops
Intel has quietly released two new Arc Alchemist-series graphics processors for laptops. The new Arc A530M and Arc A570M target mid-range notebooks designed for light gaming. Perhaps the most...
3 by on 8/2/2023
China Imposes New Export Restrictions on Gallium and Germanium
China this week formally imposed new export regulations on gallium and germanium, as well as materials incorporating them. This move is broadly seen as a retaliatory act for the...
6 by on 8/2/2023
Western Digital Preps 28 TB UltraSMR Hard Drive
Western Digital is gearing up to start sampling of its 28 TB nearline hard drive for hyperscalers. The new HDD will use the company's energy-assisted perpendicular magnetic recording (ePMR...
19 by on 8/1/2023
TeamGroup Unveils JEDEC-Spec DDR5-6400 Memory Kits: Faster 1.1V DDR5 On The Way For Future CPUs
While DDR5 memory has been out and in use for a couple of years now, so far we haven't seen the memory reach its full potential – at least...
5 by on 7/31/2023
Dozens of Companies Adopt TSMC's 3nm Process Technology
Designing chips for modern, leading-edge manufacturing technologies is an expensive endeavor. Still, dozens of companies have already adopted TSMCs N3 and N3E (3 nm-class) fabrication processes, according to disclosures...
9 by on 7/28/2023
Samsung Begins to Produce Third 3nm Chip Amid Massive Losses On DRAM & NAND
Samsung this week reported their financial results for the second quarter of 2023, closing the book on an especially bleak quarter of the year with a massive $3.4 billion...
14 by on 7/28/2023
Seagate Ships First Commercial HAMR Hard Drives
Seagate announced this week that it had begun the first commercial revenue shipments of its next-generation HAMR hard drives, which are being shipped out as part of Seagate's latest...
3 by on 7/28/2023
Micron Publishes Updated DRAM Roadmap: 32 Gb DDR5 DRAMs, GDDR7, HBMNext
In addition to unveiling its first HBM3 memory products yesterday, Micron also published a fresh DRAM roadmap for its AI customers for the coming years. Being one of the...
4 by on 7/27/2023
Rapidus Wants to Supply 2nm Chips to Tech Giants, Challenge TSMC
It has been a couple of decades since a Japanese fab has offered a leading-edge chip manufacturing process. Even to this day, none of the Japanese chipmakers have made...
19 by on 7/26/2023
Micron Unveils HBM3 Gen2 Memory: 1.2 TB/sec Memory Stacks For HPC and AI Processors
Micron today is introducing its first HBM3 memory products, becoming the latest of the major memory manufacturers to start building the high bandwidth memory that's widely used in server-grade...
7 by on 7/26/2023
TACC's Stampede3 Supercomputer Uses Intel's Xeon Max with HBM2E and Ponte Vecchio
The Texas Advanced Computing Center (TACC) unveiled its latest Stampede supercomputer for open science research projects, Stampede3. TACC anticipates that Stampede3 will come online this fall and will deliver...
5 by on 7/25/2023
TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging
TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that...
3 by on 7/25/2023
Cadence Buys Memory and SerDes PHY Assets from Rambus
In a surprising turn of events, Cadence and Rambus entered into a definitive agreement late last week for Cadence to buy memory physical interface IP and SerDes businesses from...
5 by on 7/24/2023
TSMC: 3nm Chips for Smartphones and HPCs Coming This Year
While TSMC formally started mass production of chips on its N3 (3nm-class) process technology late last year, the company is set to finally ship the first revenue wafers in...
21 by on 7/21/2023
Ultra Ethernet Consortium Formed, Plans to Adapt Ethernet for AI and HPC Needs
This week the Linux Foundation has announced that the group will be overseeing the formation of a new Ethernet consortium, with a focus on adapting and refining the technology...
7 by on 7/21/2023
Cerebras to Enable 'Condor Galaxy' Network of AI Supercomputers: 36 ExaFLOPS for AI
Cerebras Systems and G42, a tech holding group, have unveiled their Condor Galaxy project, a network of nine interlinked supercomputers for AI model training with aggregated performance of 36...
1 by on 7/21/2023
TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers
TSMC on Thursday disclosed that it will have to delay mass production at its Fab 21 in Arizona to 2025, as a lack of suitably skilled workers is slowing...
27 by on 7/20/2023
ASUS Signs Agreement to Continue Development and Support of Intel's NUC Business
ASUS and Intel late on Tuesday announced that they had agreed to a term sheet involving Intel's NUC business, ensuring the continued support of existing NUC hardware as well...
6 by on 7/19/2023
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