The AMD team surprised us here. What seemed like a very par-for-the-course Computex keynote turned into an incredible demonstration of what AMD is testing in the lab with TSMC’s new 3D Fabric technologies. We’ve covered 3D Fabric before, but AMD is putting it to good use by stacking up its processors with additional cache, enabling super-fast bandwidth, and better gaming performance. That’s the claim at any rate, and AMD showcased its new demo processor on stage at Computex. Here’s a deeper run-down into what it actually is.
AMD Discusses ‘X3D’ Die Stacking and Packaging for Future Products: Hybrid 2.5D and 3D
One of AMD’s key messages at its Financial Analyst Day 2020 is that the company wants to remain on the leading edge when it comes to process node technology...12 by Dr. Ian Cutress on 3/5/2020