TSMC has introduced a brand-new manufacturing technology roughly every two years over the past decade. Yet as the complexity of developing new fabrication processes is compounding, it is getting increasingly difficult to maintain such a cadence. The company has previously acknowledged that it will start producing chips using its N3 (3 nm) node about four months later than the industry is used to (i.e., Q2), and in a recent conference call with analysts, TSMC revealed additional details about its latest process technology roadmap, focusing on their N3, N3E, and N2 (2 nm) technologies. N3 in 2023 TSMC's N3 technology will provide full node scaling compared to N5, so its adopters will get all performance (10% - 15%), power (-25% ~ -30%), and area (1.7x higher for...
TSMC this week has announced plans to spend $100 billion on new production facilities as well as R&D over the next three years. The world's largest contract maker of...45 by Anton Shilov on 4/2/2021
SMIC first started volume production of chips using its 14 nm FinFET fabrication process in Q4 2019. Since then, the company has been hard at work developing its next...20 by Anton Shilov on 3/23/2020