Western Digital to Split HDD and NAND Businesses
Western Digital has announced its decision to split its hard disk drive and NAND memory businesses, creating two separate public companies. According to the company, the change is aimed...
12 by Anton Shilov on 10/31/2023
Crucial T500 Gen4 NVMe SSD: New Flagship Melds Micron 232L 3D TLC and Phison E25
Crucial is unveiling its latest addition to its Gen4 consumer NVMe SSD lineup today - the T500 PCIe 4.0 M.2 2280 NVMe SSD. It takes over flagship duties from...
19 by Ganesh T S on 10/31/2023
Solidigm Lays Off Employees Due to Industry Downturn
The solid state storage industry has been in a well-documented slide for the better part of the last year now. With storage product demand from both the client and...
18 by Anton Shilov on 10/25/2023
Micron and SK hynix Ship LPDDR5-9600 Memory for Next-Gen Smartphones
Fast memory is crucial for the performance of high-end system-on-chips that are getting more sophisticated every year. When it comes to smartphones, the most obvious way to boost memory...
23 by Anton Shilov on 10/25/2023
Report: AMD and NVIDIA Set to Offer Arm-Based Processors for PCs
Apple's release of Arm-based system-on-chips for its desktops and laptops three years ago demonstrated that such processors could offer competitive performance and power consumption. On the Windows-based PC front...
43 by Anton Shilov on 10/25/2023
Samsung Announces 'Shinebolt' HBM3E Memory: HBM Hits 36GB Stacks at 9.8 Gbps
Samsung’s annual Memory Tech Day is taking place in San Jose this morning, and as part of the event, the company is making a couple of notable memory technology...
10 by Ryan Smith on 10/20/2023
Zotac's Zbox Pico PI430AJ Uses Frore's AirJet Solid-State Active Cooling
Zotac has introduced the industry's first compact PC featuring Frore's AirJet solid-state cooling system. Zotac's ultra-compact Zbox Pico PI430AJ is powered by Intel's Core i3 processor is designed primarily...
18 by Anton Shilov on 10/20/2023
TSMC Q3 Earnings: 3nm Production Node Accounts for 6% of Revenue
Although Taiwan Semiconductor Manufacturing Co. formally started production of chips using its N3 (3nm-class) process technology back in late 2022, the company did not recognize any meaningful N3 revenue...
7 by Anton Shilov on 10/19/2023
Seagate Unveils Exos X24 24TB and 28 TB: Setting the Stage for HAMR HDDs
Seagate on Wednesday introduced its Exos X24 family of hard drives, it's highest capacity series of drives to date. The new family is comprised of both conventional magnetic recording...
16 by Anton Shilov on 10/19/2023
Arm Total Design to Facilitate Development of Custom Datacenter SoCs
Arm this week introduced its Arm Total Design initiative, which is aimed at accelerating development of custom datacenter-oriented system-on-chip (SoC) designs using Neoverse Compute Subsystems (CSS). The collaborative ecosystem...
1 by Anton Shilov on 10/18/2023
Qualcomm Swaps Out Arm for RISC-V for Next-Gen Google Wear OS Devices
As part of a broad collaborative agreement with Google, Qualcomm this week said that that it will be adopting the RISC-V instruction set architecture (ISA) for a future Snapdragon...
8 by Anton Shilov on 10/18/2023
Canon Prepares Nanoimprint Lithography Tool To Challenge EUV Scanners
Canon has recently revealed its FPA-1200NZ2C, a nanoimprint semiconductor manufacturing tool that can be used to make advanced chips. The device uses nanoimprint lithography (NIL) technology as an alternative...
13 by Anton Shilov on 10/17/2023
Intel Announces 14th Gen Core Series For Desktop: Core i9-14900K, Core i7-14700K and Core i5-14600K
Ahead of tomorrow's full-scale launch, Intel this afternoon is pre-announcing their 14th Generation Core desktop processors. Aptly codenamed Raptor Lake Refresh, these new chips are based on Intel's existing...
30 by Gavin Bonshor on 10/16/2023
TSMC: We Want OSATs to Expand Their Advanced Packaging Capability
Almost since the inception of the foundry business model in the late 1980s, TSMC would produce silicon. In contrast, an outsourced semiconductor assembly and test (OSAT) service provider would...
2 by Anton Shilov on 10/16/2023
TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion
Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC's roadshow was dedicated to the next generation of...
20 by Anton Shilov on 10/12/2023
Samsung Lines Up First Server Customer For 3nm Fabs
Although Samsung Foundry was the first contract fab to formally start mass production of chips on a 3 nm-class process, so far, the company's latest process has largely been...
5 by Anton Shilov on 10/12/2023
HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface
High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1...
11 by Anton Shilov on 10/12/2023
TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips
This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better...
4 by Anton Shilov on 10/12/2023
Intel Launches Arc A580: A $179 Graphics Card for 1080p Gaming
When Intel unveiled its range of Arc A-series desktop graphics cards last year, it introduced four models: the Arc A770, Arc A750, Arc A580, and Arc A380. However, the...
9 by Anton Shilov on 10/10/2023
Intel to Spin-off Programmable Solutions Group as Standalone Business, Eyeing IPO in 2-3 Years
Intel this afternoon has announced that the company will be spinning off its programmable solutions group (PSG), to operate as a standalone business. The business unit, responsible for developing...
14 by Ryan Smith on 10/3/2023
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