XPG Demos "Nia" Handheld Gaming PC With Foveated Rendering, Swappable DRAM
With the rise of the handheld gaming PC market, we've seen PC vendors and their partners toy with a number of tricks and tweaks to improve improve framerates in...
10 by Anton Shilov on 6/5/2024
G.Skill Demonstrates DDR5-10600 Memory Modules On Ryzen 8500G System
Ultra-high performance memory modules are a staple of of Computex, and it looks like this year G.Skill is showing off the highest performance dual-channel memory module kit to date...
7 by Anton Shilov on 6/5/2024
Update on Intel's Panther Lake at Computex 2024, Intel Powering Up Intel 18A Wafer Next Week
During the Intel keynote hosted by CEO Pat Gelsinger, he gave the world a glimpse into the Intel Client roadmap until 2026. Meteor Lake launched last year on that...
13 by Gavin Bonshor on 6/4/2024
Frore Demos Solid-State AirJet Cooler in Action: Significantly Improving Both Laptop and SSD Performance
In recent months, Frore Systems has been turning heads with their fanless solid-state air cooler technology. The AirJet, as it's come to be called, was previously shown off at...
5 by Anton Shilov on 6/4/2024
AMD Announces Zen 5-based EPYC “Turin” Processors: Up to 192 Cores, Coming in H2’2024
With AMD’s Zen 5 CPU architecture only a month away from its first product releases, the new CPU architecture was placed front and center for AMD’s prime Computex 2024...
29 by Ryan Smith on 6/3/2024
AMD Slims Down Compute With Radeon Pro W7900 Dual Slot For AI Inference
While the bulk of AMD’s Computex presentation was on CPUs and their Instinct lineup of dedicated AI accelerators, the company also has a small product refresh for the professional...
2 by Ryan Smith on 6/2/2024
AMD Launching New CPUs for AM4: Ryzen 5000XT Series Coming in July
During their opening keynote at Computex 2024, AMD announced their intention to launch a pair of new Ryzen 5000 processors for their legacy AM4 platform. The new chips, both...
18 by Gavin Bonshor on 6/2/2024
TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027
TSMC's 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company's recent technology symposium, TSMC outlined a roadmap that will take...
1 by Anton Shilov on 5/31/2024
TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025
In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The...
9 by Anton Shilov on 5/30/2024
Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab
To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and...
12 by Anton Shilov on 5/24/2024
MSI Teases Z790 Project Zero Plus Motherboard With CAMM2 Memory Support
MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve...
10 by Anton Shilov on 5/24/2024
TSMC's Roadmap at a Glance: N3X, N2P, A16 Coming in 2025/2026
As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company's most...
47 by Anton Shilov on 5/22/2024
TSMC Offers a Peek at 'Global Gigafab' Process Replication Program
At its European Technology Symposium last week TSMC revealed some of the details about its Global Gigafab Manufacturing program, the company's strategy to replicate its manufacturing processes across its...
11 by Anton Shilov on 5/22/2024
TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026
Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC's chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely...
8 by Anton Shilov on 5/21/2024
One More EPYC: AMD Launches Entry-Level Zen 4-based EPYC 4004 Series
Ever since AMD re-emerged as a major competitor within the x86 CPU scene, one of AMD’s top priorities has been to win over customers in the highly lucrative and...
14 by Ryan Smith on 5/21/2024
Lenovo Unveils Yoga Slim 7x 14 Gen 14 and ThinkPad T14 Gen 6 Notebooks Powered By Qualcomm Snapdragon X Elite
While we've been expecting the availability of the Qualcomm Snapdragon X Elite processor to be around the middle of this year, Lenovo has announced two new 'AI-powered' notebooks for...
19 by Gavin Bonshor on 5/20/2024
TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry
Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be...
20 by Anton Shilov on 5/17/2024
Not Dead Yet: WD Releases New 6TB 2.5-Inch External Hard Drives - First Upgrade in Seven Years
UPDATE 5/17, 6 PM: Western Digital has confirmed that the new 2.5-inch T GB HDDs uses 6 SMR platters The vast majority of laptops nowadays use solid-state drives, which is...
13 by Anton Shilov on 5/16/2024
TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node
With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity...
0 by Anton Shilov on 5/16/2024
TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from...
1 by Anton Shilov on 5/16/2024
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