HBM
SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory maker and the U.S., as this is the first advanced memory packaging facility in the country and the company's first significant manufacturing operation in America. The facility will be used to build next-generation types of high-bandwidth memory (HBM) stacks when it begins operations in 2028. Also, SK hynix agreed to work on R&D projects with Purdue University. "We are excited to become the first in the industry to build a state-of-the-art advanced packaging facility for AI products in the United States that will help strengthen supply-chain resilience and develop a local semiconductor ecosystem," said SK hynix...
HBM Revenue Poised To Cross $10B as SK hynix Predicts First Double-Digit Revenue Share
Offering some rare insight into the scale of HBM memory sales – and on its growth in the face of unprecedented demand from AI accelerator vendors – the company...
6 by Anton Shilov on 3/28/2024
Report: SK Hynix Mulls Building $4 Billion Advanced Packaging Facility in Indiana
SK hynix is considering whether to build an advanced packaging facility in Indiana, reports the Wall Street Journal. If the company proceeds with the plan, it intends to invest...
4 by Anton Shilov on 3/26/2024
SK Hynix Starts Mass Production of HBM3E: 9.2 GT/s
SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the...
3 by Anton Shilov on 3/19/2024
SK Hynix Mulls 'Differentiated' HBM Memory Amid AI Frenzy
SK Hynix and AMD were at the forefront of the memory industry with the first generation of high bandwidth memory (HBM) back in 2013 – 2015, and SK Hynix...
10 by Anton Shilov on 3/1/2024
Samsung Launches 12-Hi 36GB HBM3E Memory Stacks with 10 GT/s Speed
Samsung announced late on Monday the completion of the development of its 12-Hi 36 GB HBM3E memory stacks, just hours after Micron said it had kicked off mass production...
4 by Anton Shilov on 2/27/2024
Micron Kicks Off Production of HBM3E Memory
Micron Technology on Monday said that it had initiated volume production of its HBM3E memory. The company's HBM3E known good stack dies (KGSDs) will be used for Nvidia's H200...
8 by Anton Shilov on 2/26/2024
Samsung Announces 'Shinebolt' HBM3E Memory: HBM Hits 36GB Stacks at 9.8 Gbps
Samsung’s annual Memory Tech Day is taking place in San Jose this morning, and as part of the event, the company is making a couple of notable memory technology...
10 by Ryan Smith on 10/20/2023
HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface
High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1...
11 by Anton Shilov on 10/12/2023
Micron to Ship HBM3E Memory to NVIDIA in Early 2024
Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for...
7 by Anton Shilov on 9/28/2023
Memory Makers on Track to Double HBM Output in 2023
TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing...
9 by Anton Shilov on 8/9/2023
Micron Publishes Updated DRAM Roadmap: 32 Gb DDR5 DRAMs, GDDR7, HBMNext
In addition to unveiling its first HBM3 memory products yesterday, Micron also published a fresh DRAM roadmap for its AI customers for the coming years. Being one of the...
4 by Anton Shilov on 7/27/2023
Micron Unveils HBM3 Gen2 Memory: 1.2 TB/sec Memory Stacks For HPC and AI Processors
Micron today is introducing its first HBM3 memory products, becoming the latest of the major memory manufacturers to start building the high bandwidth memory that's widely used in server-grade...
7 by Anton Shilov on 7/26/2023
As The Demand for HBM Explodes, SK Hynix is Expected to Benefit
The demand for high bandwidth memory is set to explode in the coming quarters and years due to the broader adoption of artificial intelligence in general and generative AI...
9 by Anton Shilov on 4/18/2023
Intel Showcases Sapphire Rapids Plus HBM Xeon Performance at ISC 2022
Alongside today’s disclosure of the Rialto Bridge accelerator, Intel is also using this week’s ISC event to deliver a brief update on Sapphire Rapids, the company’s next-generation Xeon CPU...
22 by Ryan Smith on 5/31/2022
Intel to Launch Next-Gen Sapphire Rapids Xeon with High Bandwidth Memory
As part of today’s International Supercomputing 2021 (ISC) announcements, Intel is showcasing that it will be launching a version of its upcoming Sapphire Rapids (SPR) Xeon Scalable processor with...
150 by Dr. Ian Cutress on 6/28/2021
2023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package
High-performance computing chip designs have been pushing the ultra-high-end packaging technologies to their limits in the recent years. A solution to the need for extreme bandwidth requirements in the...
35 by Andrei Frumusanu on 8/25/2020
Micron to Launch HBM2 DRAM This Year: Finally
Bundled in their latest earnings call, Micron has revealed that later this year the company will finally introduce its first HBM DRAM for bandwidth-hungry applications. The move will enable...
14 by Anton Shilov on 3/27/2020
AMD Discusses ‘X3D’ Die Stacking and Packaging for Future Products: Hybrid 2.5D and 3D
One of AMD’s key messages at its Financial Analyst Day 2020 is that the company wants to remain on the leading edge when it comes to process node technology...
12 by Dr. Ian Cutress on 3/5/2020
SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM
SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...
9 by Anton Shilov on 2/11/2020
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